Ensphere Solutions News/Events
Ensphere’s Shipments of Light Peak Transceiver Chips Exceeded 500k in 2011
-- The First Cost Effective Optical Transport for Laptops, and A Major Milestone for Ensphere --
Santa Clara, Calif., October 3, 2011 – Ensphere Solutions, an emerging leader in advanced communications semiconductor ICs, today announced that the aggregate shipments of ESI-XVR10100 to multiple customers have exceeded 500k devices in 2011. This product is a dual 10G transceiver device intended for Light Peak optical modules. XVR10100 can also be used in ThunderboltTM active optical cables (AOCs).
Light Peak is the codename for an architecture developed by Intel Corporation. It is a new high- speed I/O technology able to support two independent full-duplex 10 Gbps links. It is intended for connecting laptop computers and a variety of other portable devices to peripherals such as external monitors and storage devices. It is a flexible and scalable technology and supports daisy chaining effectively reducing the number of system connectors.
Ensphere Solutions’ ESI-XVR10100 is the only integrated circuit (IC) needed in the optical module and can support up to two independent full-duplex 10 Gbps links. It is a monolithic device with a flexible architecture supporting out-of-band signaling, and various power management modes.
“One of our challenges has been to integrate two sets of 10G transmit and receive stages on a single CMOS die, and still meet stringent performance metrics” said Hessam Mohajeri, Ensphere’s Chief Executive Officer. “A bigger challenge has been to meet extremely demanding price and power dissipation targets mandated by our customers”.
“Our product offering is far more than just a functional and cost effective chip. Ensphere’s true value add is its wealth of experience accumulated while working with its customers, partners, and PC OEMs.” said Al Gharakhanian, Ensphere’s Vice President of Marketing.
ESI-XVR10100 can also be utilized in ThunderboltTM active optical cables (AOCs). Active optical cables are cable assemblies that have electrical terminations on both ends but use optical fibers for data transport within the cable. The electrical-to-optical and optical-to-electrical conversions are done internally. ESI-XVR10100 is an ideal transceiver for this purpose.
Availability
ESI-XVR10100 is now available in die form in production quantities.
About Ensphere Solutions Inc.
Ensphere Solutions Inc., a privately held company based on Silicon Valley, CA., offers advanced communications semiconductor standard products. The initial focus of the company is to develop and market physical layer chips for optical and copper interconnect technologies intended for consumer electronic and portable platforms.
For more information visit www.enspheresolutions.com
Contact:
Al Gharakhanian
Vice President of Marketing
agharakhanian@enspheresolutions.com
(408) 850-3520
Ensphere Solutions Announced the Availability of An Ultra Low Power Wireless Transceiver Intellectual Property (IP) for ISM Band (400 – 960 MHz)
-- ESI-TRX401 Intellectual Property is Based on TSMC’s 180 nm CMOS Process and is Ideal for Integration in Chips Targeting Smart Grid and Home Automation Applications --
Santa Clara, Calif., May 23, 2011 – Ensphere Solutions, an emerging leader in advanced communications semiconductor ICs, announced the availability of ESI-TRX401 wireless transceiver radio intellectual property (IP) for ISM band (400-960 MHz). This core has been implemented using TSMC’s 180nm CMOS process. This IP is an ideal radio for Application Specific Integrated Circuits (ASICs) and Application Specific Standard Products (ASSPs) needing wireless connectivity. Smart meters, building automation, remote keyless entry, and sensor mesh networks are among key applications that can be served well by this IP.
The following are some of the key performance parameters of this core:
• Sensitivity: -110 dBm
• Output Power Range: -8.0 to +15 dBm
• Ultra Low Power Consumption: 16 mA @ receive
13 mA @ 0 dBm transmit power
31 mA @ 13 dBm transmit power
• Data Rate: 0.397 – 200 kbps
• Modulation: FSK/GFSK
Ensphere will make this technology available to its customers in one of two possible ways. Ensphere will offer this core as a standalone IP for integration in devices being developed by its customers. Alternatively, ESI offers design services for developing custom chips based on ESI-TRX401. Ensphere has access to an extensive library of internal and external IPs that can be integrated alongside to this core.
“Supporting some type of wireless connectivity in newer ASICs and ASSPs has become a hard requirement and is no longer an optional nicety,” said Hessam Mohajeri Ensphere’s Chief Executive Officer. “Introduction of ESI-TRX401 is a significant milestone for Ensphere, our goal is to offer a mature and conformant ISM radio core allowing our customers to focus on other aspects of their program.”
“We have chosen a very mature and popular process technology to implement this IP,” said Al Gharakhanian, Vice President of Marketing. “Our challenge has been to strike a balance between process maturity, wafer pricing, and non-recurring expenses associated with developing an analog-intensive ASIC targeting high volume applications.”
About Ensphere Solutions Inc.
Ensphere Solutions Inc., a privately held company, offers advanced communications semiconductor ICs, IP cores and professional design services. Based in Silicon Valley, CA., the company specializes in the development of standard and custom mixed signal devices and RF chips. The company’s standard products are targeted for high-speed optical data communications.
For more information visit www.enspheresolutions.com
Contact:
Al Gharakhanian
Vice President of Marketing
agharakhanian@enspheresolutions.com
(408) 850-3520
Kaiam Selects Ensphere’s 10G Shunt Laser Driver for their New 40G Quad Transmit Sub-Assembly
-- ESI-1010’s Small Die Size and Low Power Dissipation Makes It An Ideal Device for Space-Constrained Applications --
Santa Clara, Calif., March 23, 2011 – Ensphere Solutions, Inc. an emerging leader in advanced communications semiconductor ICs, announced today the adoption of Ensphere Solutions’ ESI-1010 10G shunt laser driver by Kaiam Corporation. This driver will be used in Kaiam’s new 40G compact QSFP+ Transmit Optical Subassembly (TOSA).
Kaiam Corporation, an emerging company with a breakthrough hybrid optical integration technology, successfully demonstrated a new QSFP+ transmitter and receiver optical subassemblies (ROSA) for 40GBASE-LR4 applications at OFC/NFOEC 2011 in Los Angeles. The 4 channel by 10Gb/s TOSA and ROSA transmit and receive, respectively, a cumulative 40Gb/s in a single mode fiber with a 10km reach. The technology is able to achieve the very high densities needed for such compact transceivers.
Kaiam’s new TOSA and ROSA have raised the bar for the power dissipation, density, and manufacturing cost of 40G optical modules. This has been accomplished by using proprietary micromechanics to solve the alignment issues and build hybrid photonic integrated circuits (PICs).
“The next generation 40Gb/s pluggable modules (QSFP+) for single mode fiber require more than an order of magnitude reduction in area. ESI-1010 has been a key element, allowing us to increase the density while simultaneously reducing power dissipation and improving signal integrity” said Dr. Thomas Schrans, Kaiam’s Vice President of Engineering and Product Development.
“We are extremely pleased for having the opportunity to work with Kaiam. Their extensive background in optics and deep appreciation of system-level issues has enabled us to optimize the performance of ESI-1010” said Hessam Mohajeri, Ensphere’s Chief Executive Officer.
ESI-1010 is a single channel 10G laser diode driver (LDD) able to support a wide variety of laser RC time constants. It is capable of supplying up to 100 mA of bias and 50 mA of modulation currents. In a shunt configuration, ESI-1010 assumes the heavy burden of driving a low impedance laser diode while presenting a 50Ω load to the preceding driver, which is far easier to drive.
About Ensphere Solutions Inc.
Ensphere Solutions Inc., a privately held company, offers advanced communications semiconductor ICs, IP cores and professional design services. Based in Silicon Valley, CA., the company specializes in the development of standard and custom mixed signal transceivers and RF chips. The company’s standard products are targeted for high-speed optical data communications.
About Kaiam Corporation
Headquartered in Newark, California, Kaiam Corporation is a private company commercializing photonic integrated circuits for various applications. Founded by leading technologists from the optical networking industry, the team has a record of delivering breakthrough products that change the rules of the marketplace. It is currently working with multiple partners to deliver PIC-based products for various fiber optic applications. For more information, visit http://www.kaiamcorp.com.
For more information visit www.enspheresolutions.com
Contact:
Al Gharakhanian
Vice President of Marketing
agharakhanian@enspheresolutions.com
(408) 850-3520
Ensphere Solutions Announced the Availability of a New 10G Transceiver and Low Power Laser Diode Shunt Driver ICs Targeting 10G Optical Modules.
-- An Optimized Pair Intended to Minimize the Power Dissipation of 10G Optical Modules --
Santa Clara, Calif., January 24, 2011 – Ensphere Solutions, Inc. an emerging leader in advanced communications semiconductor ICs, today announced the availability of a new 10G transceiver IC (ESI-1002) as well as matching laser diode shunt driver IC (ESI-1010).
ESI-1002 is a highly integrated 10G Optical Transceiver Device with integrated limiting amplifier (LIA) and vertical-cavity surface emitting laser (VCSEL) driver. It can be used in optical modules for 10G Ethernet, 4G, and 8G Fiber Channel (FC). It is fully compliant to SFF-8472 electrical requirements and supports a SPI processor interface for diagnostics and monitoring. The device includes elaborate circuitry to monitor key parameters such as system supply voltage, temperature, laser bias and modulation currents, transmit power levels, and many other key parameters. This device can also be used to drive FP/DFB laser in conjunction with an external driver such as ESI-1010. ESI-1002 can drive VCSELs with up to 28mA modulation current. A complete system will have a power dissipation of less than 800mW which includes the laser current.
ESI-1010 is a single channel 10G laser diode driver (LDD) able to support a wide variety of laser RC time constants. It is capable of supplying up to 100 mA of bias and 50 mA of modulation currents. In a shunt configuration, ESI-1010 assumes the heavy burden of driving a low impedance laser diode while presenting a 50Ω load to the preceding driver which is far easier to drive. This configuration reduces the overall power dissipation of the system dramatically. ESI-1010 is implemented in a low power CMOS technology and has a power dissipation of only 50 mW. This device is available in die form and can be installed in constricted spaces adjacent to the actual FP/DFB laser. This minimizes the length of bond wires. Its predriver can be conveniently placed further away with no risk of signal integrity degradation.
“These products have been defined and developed in close cooperation with leading optical module vendors and are being shipped in volume” said Hessam Mohajeri, Ensphere’s Chief Executive Officer. “Aside from low power dissipation, their key differentiation is the fact that they have been part of real live networks and have passed the test of time with flying colors”.
“Our application engineering team has a wealth of experience in building optical modules based on these products” said Al Gharakhanian, Ensphere’s VP of Marketing. “We have found that optimized packaging and installation techniques to be as important as device performance in determining the overall performance of the optical module”.
Availability
These two products are released to production and are available for volume shipment. The pair is priced at $5 in high volumes.
About Ensphere Solutions Inc.
Ensphere Solutions Inc., a privately held company, offers advanced communications semiconductor ICs, IP cores and professional design services. Based in Silicon Valley, CA, the company specializes in the development of standard and custom mixed signal transceivers and RF chips. The company’s standard products are targeted for high-speed optical data communications.
Contact:
Al Gharakhanian
Vice President of Marketing
agharakhanian@enspheresolutions.com
(408) 850-3520
Ensphere Solutions Announces the Availability of 12-port and 4-port 10G Laser Diode Driver Arrays Targeting 10G, 40G, and 100G Long Haul Optical Modules
-- Most integrated and smallest driver arrays for FP/DFB lasers --
Santa Clara, Calif., June 14, 2010 – Ensphere Solutions, Inc. an emerging leader in advanced communications semiconductor ICs, today announced the availability of two new 10G laser diode driver arrays (LDDs). The 10G drivers provide a highly integrated solution for 10G, 40G, and 100G optical modules where they deliver high performance and low solution costs in four-port (ESI-1014), and twelve-port (ESI-1110) applications.
ESI-1014 and ESI-1110 driver arrays are able to support a wide variety of laser RC time constants, allowing them to drive FP/DFB lasers. They are capable of supplying up to 100 mA of bias and 50 mA of modulation currents (per port). When used in a shunt configuration, they can dramatically reduce a design’s overall power dissipation and PCB area by assuming the heavy burden of driving low impedance laser diodes while presenting a 100Ω load to the preceding driver. In addition, crosstalk between adjacent ports is less than -30 dB. Ensphere’s LDDs are implemented in a low power CMOS technology and only consume 100 mW/port - including the power dissipated by the laser.
Both laser driver ICs are available as raw dies, in either flip-chip or die-bonding configurations. They are fully characterized over industrial temperature range.
“These products have been defined and developed in close cooperation with leading optical module vendors” said Hessam Mohajeri, Ensphere’s Chief Executive Officer. “The single most important differentiator for these products is the system performance they deliver while all channels are running at full speed”.
“The die for these arrays can be mounted directly adjacent to the laser array within the optical subassembly or module. This scheme minimizes the footprint and trace lengths improving the performance and compactness of the module” said Al Gharakhanian, Ensphere’s VP of Marketing. “Our application engineering team has accumulated a wealth of experience building optical modules using these drivers”.
Availability
Sample quantities of the ESI-1014 and ESI-1110 driver arrays are available now. Production quantities of both devices will be available at the end of August 2010. Contact Ensphere Solutions for pricing.
About Ensphere Solutions Inc.
Ensphere Solutions Inc., a privately held company, offers advanced communications semiconductor ICs, IP cores and professional design services. Based in Silicon Valley, CA., the company specializes in the development of standard and custom mixed signal transceivers and RF chips. The company’s standard products are targeted for high-speed optical data communications.
For more information visit www.enspheresolutions.com
Contact:
Al Gharakhanian
Vice President of Marketing
agharakhanian@enspheresolutions.com
(408) 850-3520
Ensphere Solutions Announced the Availability of a High Accuracy Temperature Sensor Intellectual Property
-- Newly Enhanced ESI-P3010 Features +/-1oC Accuracy with 16-bit Digital Readout Implemented in TSMC 65 nm-G CMOS Process--
Santa Clara, Calif., March 8, 2010 – Ensphere Solutions, Inc. an emerging leader in advanced communications Integrated Circuits (ICs) and Intellectual Properties (IPs), today announced the availability of a new enhanced temperature sensor core
Ensphere Solutions’ new ESI-P3010 is a power and area optimized IP implemented in mainstream processes such as TSMC 65nm-G and TowerJazz 180 nm. This core consists of a temperature sensor connected to one of the eight inputs of an analog multiplexer. The output of this multiplexer can be scaled by a programmable gain stage prior to being digitized by a 16-bit Sigma-Delta ADC. The remaining seven DC input channels can be used for signal monitoring and digitizing of other analog input signals. Virtually all key parameters of this core is user programmable per channel basis including the gain, calibration settings (offset and slope), and filter parameters. The total area of this IP is 0.25mm2 and total power dissipation is 4.9mW with all channels active. The total power down current is 19nA.
“The capabilities of this IP go far beyond a generic temperature sensor. It can be used to monitor die temperature as well as seven other DC levels. Highly customizable nature of this IP makes it suitable for most SoCs with various degrees of complexity” said Al Gharakhanian, Vice President of Marketing at Ensphere Solutions.
About Ensphere Solutions Inc. Ensphere Solutions Inc., a privately held company, offers advanced communications semiconductor ICs, IP cores and professional design services. Based in Silicon Valley, CA, the company specializes in the development of standard and custom mixed signal transceivers and RF chips. The company’s standard products are targeted for high-speed optical data communications.
Sales Inquiries: sales@enspheresolutions.com
www.enspheresolutions.com
Ensphere Solutions Secures $4 Million Investment from Ideavelopers
-- New Investment Will Fuel Future R/D, and Rapid Commercialization of “Light Peak” Transceivers --
Santa Clara, Calif., Oct. 22, 2009 – Ensphere Solutions, Inc. an emerging leader in advanced communications semiconductor ICs, received a $4 million investment from Ideavelopers in August of 2009. Ideavelepers is a pioneer in high-technology investment in Middle East and manages Egypt’s first technology venture capital fund "The Technology Development Fund".
“We are extremely excited about our partnership with Ideavelopers” said Hessam Mohajeri, Chief Executive Officer of Ensphere Solutions. “Idealvelopers’ investment will help us to expedite our product development and rollout plans. In addition to financial backing, we can tremendously benefit from Ideavelopers’ experience and industry contacts”.
“We are proud to be engaged with one of the most promising emerging semiconductor companies addressing the optical market,” said Ahmad Gomaa CEO of Ideavelopers. “Ensphere has aggressive plans to launch a portfolio of exciting optical products including transceivers ICs for Intel’s Light Peak technology. Light Peak will have an enormous market footprint reaching applications such as PCs, peripherals, workstations, displays, mobile handsets, docking stations, and more. Ensphere is well positioned to reap benefits from this exciting market”.
Light Peak is an emerging fiber optics-based interconnect technology architected by Intel Corporation. It has been designed to support data rates up to 10 Gb/s with the potential of reaching 100 Gb/s over the next decade. This technology has shattered size, cost, and power barriers making it the first optical connectivity technology suitable for mainstream applications.
In addition to Light Peak transceivers, Ensphere has a diverse product portfolio addressing front-end physical layer chips for various optical and copper interfaces. These products include Limiting Amplifiers (LA), Transimpedance Amplifiers (TIA), Clock/Data Recovery devices, and Laser Drivers for various interfaces with date rates of 1 Gb/s to 40 Gb/s.
About Ensphere Solutions Inc.
Ensphere Solutions, Inc. is a privately held fabless semiconductor company headquartered in Santa Clara, California with a design center in Cairo, Egypt. Ensphere develops and markets semiconductor products for various optical interfaces used in mainstream applications in communication, consumer electronic, and computing markets. In addition to chip-level products, Ensphere has offered design services and intellectual properties (IPs) to its strategic customers.
About Ideavlopers:
Founded in 2001, Ideavelopers, a subsidiary of EFG-Hermes, and fund advisor for The Technology Development Fund, partners with technology entrepreneurs to greatly increase their chance of success. Ideavelopers’ priority is to support entrepreneurs and early-stage business by providing quality venture development services. Ideavelopers has already participated in the funding of 40 technology-driven companies on behalf of its investment partnerships.
Ideavelopers brings together the resources, experience, and strategic relationships needed to build the next generation of leading technology companies. We take companies through the entire business process, from the inception of an idea through to the creation of a business built on a solid foundation. Whether Ideavelopers provides advice on fine-tuning business plans, investment money, intensive guidance, or executive recruiting, Ideavelopers is here to help improve the rate of success.
Contacts
Ideavelopers Enshpere Solutions, Inc.
Tania Hamilton Al Gharakhanian
Marketing Officer 2900 Lakeside Dr. #228
Ideavelopers Santa Clara, CA 95138
+ 202. 3534. 6064 + 408 850 3520
thamilton@ideavelopers.com agharakhanian@enspheresolutions.com
Ensphere Solutions to Deliver New Transceiver Integrated Circuit for Intel’s Light Peak Optical Interconnect Technology
-- New ESI-XVR10100 Features Low Power Consumption and Provides Dual Channel Operation, Full TX/RX Operation at 10Gbps in Compact Die --
Santa Clara, Calif., Oct. 8, 2009 – Ensphere Solutions, Inc. an emerging leader in advanced communications semiconductor ICs, today announced the availability of a new transceiver IC for the rapidly-developing converged I/O interconnect Light Peak technology
Ensphere Solutions’ new ESI-XVR10100 is a cost-effective IC which interfaces with optical links and provides signal conversion between optical and electrical signals. It is one of the key building blocks of the Light Peak technology. Light Peak is a new transport technology that uses fiber optics instead of copper wires and is able to support full duplex data rates up to 10 Gbps. It supports legacy protocols such as USB, HDMI, DisplayPort, PCIe and others. The technology is designed from ground up to be inexpensive and small. It supports a wide range of devices such as handhelds, laptops, PCs, CE, and others.
Light Peak, developed by Intel Corporation, enables a single connection for video, storage devices, printers, webcams, and other peripherals that connect to a PC.. Its universal connector has the potential to replace multiple incompatible sockets. The ESI-XVR10100 monolithic device supports two independent channels, each with separate transmit and receive signal paths operating at 10 Gbps. Its flexible architecture supports multiple diagnostic modes as well as a comprehensive set of power management modes. ESI-XVR10100 is fabricated using deep submicron CMOS process technology, ensuring lowest power dissipation and cost with the flexibility to offer variations and customization for a broad range of applications.
“We have worked closely with Intel on this new design to assure optimal performance and minimal power dissipation, which is a key requirement for future portable applications,” said Hessam Mohajeri, Ensphere Solutions Chief Executive Officer. “Ensphere has a wealth of experience designing products supporting high data rates such as 10 Gbps as well as 25 Gbps. We are accustomed toproviding intense technical support to our customers, which is. This support is absolutely essential in order to overcome the challenge of designing systems and modules running at such high data rates.”
“Intel is pleased to be working with Ensphere Solutions to make Light Peak transceiver components ready for 2010,” said Jason Ziller, director, Optical I/O Program Office, Intel Corp. “The company has significant experience in advanced communications technology and design expertise that is vital to the implementation of Light Peak.”
Availability
Sample quantities of ESI-XVR10100 are available now and production quantities will be available at the end of this quarter.
About Ensphere Solutions Inc.
Ensphere Solutions Inc., a privately held company, offers advanced communications semiconductor ICs, IP cores and professional design services. Based in Silicon Valley, CA, the company specializes in the development of standard and custom mixed signal transceivers and RF chips. The company’s standard products are targeted for high-speed optical data communications.
Ensphere Solutions Announces the Availability of a Color LVDS Transmitter IP for Flat Panel Displays
Santa Clara, California June 30, 2007 – Ensphere Solutions, Inc. a fabless semiconductor company focusing on high performance mixed signal and RF devices and IPs; announced the availability of a complete 80 MHz pixel LVDS transmitter offering up to 2.8 Gbps over 5 lanes targeting flat panel applications. This IP enables SoC vendors to support on-chip LVDS transmitters.
or additional information please contact sales@ensphereSolutions.com
Ensphere Solutions Announces the Availability of a Complete HDTV Front-end
Santa Clara, California May 10, 2007 – Ensphere Solutions, Inc. a fabless semiconductor company focusing on high performance mixed signal and RF devices and IPs; announced the availability of a complete front-end IP for HDTV receivers. Its state of the art, low power ADCs and clock recovery blocks; are ideal for integration in chips containing significant amount of digital noise. This IP also includes an LVDS transmitter, which makes it a complete system suited for HDTV applications.
Ensphere Solution Starts Operation in Santa Clara, California
Santa Clara, California October 1, 2006 – Ensphere Solutions, Inc. a fabless semiconductor company focusing on high performance mixed signal and RF devices and IPs; has launched its operation with offices in Santa Clara, California. This office will serve as the worldwide headquarter for company’s design, sales, and marketing operations.